Click to download the DG150WW Full Spec Sheet.

Click to download the DG200WW Full Spec Sheet.

Brand New With Warranty

Applications

• Accommodates substrates mounted on film frames, tape rings or un-mounted
• Film frames for round substrates up to 8” (200mm)
• Square substrates up to 8” x 8” (200mm x 200mm)
• Typical system applications:
• Wafer cleaning after dicing
• Photo-mask cleaning
• Thin Film substrate cleaning
• Wafer flux cleaning (flip chip)

Model DG150WW / DG200WW

Manually Loaded Automatic Cleaning System

Features

• Microprocessor based process controller with LCD screen
• Easy to navigate on screen menus
• Digitally programmed wash and dry time parameters
• Adjustable spin speed control
• Wash spray pressure up to 2500 psi
• Cylinder actuated sweep arm with adjustable speed and travel
• N2 dry with IR heat lamp eliminates all residual water
• Large IR heat lamp shield stays cool to the touch
• Splash guard prevents contamination
• Large opening for easy access to load and unload substrate
• Interchangeable spin chucks - standard or custom designs
• Chuck vacuum, N2 pressure, exhaust and cover safety interlocks
• External house drain and exhaust
• Small footprint - custom enclosures available

System Specifications

PROCESS CONTROL SYSTEM

Reciprocating Sweep Arm:

• Wash spray and N2 dry are integrated into single arm
• Interchangeable nozzles for different spray volume
• Cylinder actuated sweeping movement
• Adjustable sweep speed, travel start and stop locations

Washing System:

• Adjustable spray pressure up to 2500 psi
• Pressure release dump valve prevents nozzle drips

Drying System:

• Adjustable N2 dry pressure
• IR heat lamp 250 Watt

Spin motor:

• Direct drive spindle with DC motor
• Spin speed 100 to 3,600 rpm

Inter Changeable Chucks (Customer Specified):

• Film frame chucks with alignment pins. Vacuum hold down of substrate and centrifugal pendulum clamps for frame
• Un-mounted substrate chucks with vacuum hold down
• O-ring chucks for photo masks

SOFTWARE

PLC Process Controller:

• Time programmable wash and dry steps (2 Steps)
• Timing Range 1 to 999 seconds (1 second increments)
• Plain English on screen operation prompts and errors
• Easy to navigate on screen menus for programming processes parameters

FACILITIES AND INSTALLATION SPECIFICATIONS

*Requirements may vary depending on process