Wafer Washers: Micro Automation 2066

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Micro Automation 2066 Specifications

Features

  • Set up for 6 inch wafers and DTF 2-6-1 Film Frame
  • Has CO2 bubbler
  • Fully tested and operational
  • Function Modes:
    • Clean (Spin, high pressure spray)
    • Dry ( spin, heat and N2)
    • Wafer Release (N2 under wafer)
  • Function Duration:
    • Clean-from .1 to 180 seconds
    • Dry-from .1 to 180 seconds
    • Wafer Release – from .1 to 180 seconds
  • Chuck Speed
    • 2,000 RPM during wash and dry cycles
  • Water requirement (typically DI)
    • 30 to 70 psi
  • Cleaning pressure
    • Up to 3,000 PSI maximum (typically run at 1,800 – 2,000 PSI)
  • Air requirement
    • Compressed air or nitrogen
    • 60 to 120 PSI 7 CFM
  • Drain requirement
    • ¾" OD barb fitting with 5' length of ¾" ID
  • Power requirement
    • Standard 115 VAC, 5amps 50/60 Hz
  • N2 requirement
    • 10-40 PSI filtered ( for N2 blow-off during Dry Cycle)
    • 10-40 PSI filtered ( for wafer release)
  • Exhaust
    • 3" exhaust port plus a 5' length of flexible PVC house